Three-Dimensional Simulation Platform for Optimal Designs of the MEMS Microphone

MEMS microphone has a wide range of application prospects in electronic devices such as mobile phones, headphones, and hearing aids due to its small size, low cost, reliable performance. Research development microphones involves multiple thermo-electro-mechanical couplings among various physical electrical fields. Unfortunately, there is not an accurate three-dimensional (3D) simulation platform, which can be applied for the design chip parameters packaging characteristics. Herein, based on commercial COMSOL software, we have established 3D platform microphones, used systematically study influences geometric structure physics sensitivity frequency responses consider characteristics performance microphone. The results are consistent with those obtained using lumped element method, proves accuracy platform. explore new principles or mechanisms devices.