TSV-based hairpin bandpass filter for 6G mobile communication applications

Aimed at sixth-generation (6G) mobile communication applications, three fifth-order novel ultra-compact hairpin bandpass filter is proposed. Through-Silicon Via (TSV), a three-dimensional integration technology, used to implement the arms of units, and some units consist four arms. In this letter, design method proposed filters introduced, filtering characteristics are verified by HFSS, an industry-grade simulator based on finite element method. The results reveal that has center frequency 0.405THz, 0.3915THz, 0.3955THz with bandwidth 0.1THz, 0.077THz, 0.063THz exhibits insertion loss 2.0dB return over 12.4dB, 13.4dB, 14dB. size both 0.284 × 0.0325mm2 (1.29 0.148λg2).