Tunable Electrical Properties of Ti-B-N Thin Films Sputter-Deposited by the Reactive Gas Pulsing Process

Physical Properties of Reactively Sputter-Deposited C-N Thin Films

This work aims to prepare and study amorphous carbon nitride (CNx) films. Films were deposited by reactive magnetron radiofrequency (RF) sputtering from graphite target in argon and nitrogen mixture discharge at room temperature. The ratio of the gas flow rate was varied from 0.1 to 1. Deposited films were found to be amorphous. Highest Nitrogen concentration achieved was 42 atomic percent whic...

Effects of Cu on the microstructural and mechanical properties of sputter deposited Ni-Ti thin films

The microstructure of sputter deposited Ti-rich Ni-Ti thin films doped with Cu in the range 020.4 at.% and annealed for 1 h at 500 and 600°C has been investigated and correlated with the mechanical properties of the films measured by depth-sensing nanoindentation. X-ray diffraction analysis showed the microstructural evolution of Ni-Ti thin films when doped with Cu and annealed at different tem...

A theoretical model for the electrical properties of chromium thin films sputter deposited at oblique incidence

Electrical Properties of Plasma Deposited Thin Films

Abstract. It is well known that MIM (metal-insulator-metal) structures exhibit various high-field processes, which may be either electrode-limited (e.g. tunneling, Schottky-barrier emission) or bulk-limited (e.g. space-charge-limited conduction, Poole-Frenkel conduction). Thin films prepared using PECVD (plasma-enhanced chemical vapour deposition)exhibited Pool-Frenkel conductivity (Schottky co...

Sputter-deposited Sma Thin Films: Properties and Applications

Shape memory alloy (SMA) thin films formed by sputter deposition have attracted considerable attention in the last decade. Current intensive research demonstrated that thin films' unique fine microstructure is responsible for superior shape memory characteristics in films, compared to that of bulk materials. Simultaneously, much effort has been taken in the development and fabrication of microd...