Via Interconnections for Half-Inch Packaging of Electronic Devices Using Minimal Fab Process Tools
نویسندگان
چکیده
منابع مشابه
Inkjet-Deposited Interconnections for Electronic Packaging
Inkjet technology provides an interesting approach for electronic manufacturing. Small volumes of functional material e.g., conductive ink are dispensed on top of the substrate. Electrical circuits are formed by suitable printing sequence and sintering processes. In this paper, we present a concept of inkjet deposited System-in-Package (SiP). The package contains bare ICs and discrete passive c...
متن کاملCircuits interconnections and packaging for vlsi pdf
Wider buses require more interconnect resources and packaging pins, and the.IOSR Journal of VLSI and Signal Processing IOSRJVSP. H.Bakoglu Circuits, Interconnections and Packaging for VLSI Addison-Wesley publishing.Most logic circuits are known to exhibit q0-6 whereas, for instance, neural. B, 1990, Circuits, Interconnections and Packaging for VLSI.The growth of VLSI circuits is largely depende...
متن کاملstudy of cohesive devices in the textbook of english for the students of apsychology by rastegarpour
this study investigates the cohesive devices used in the textbook of english for the students of psychology. the research questions and hypotheses in the present study are based on what frequency and distribution of grammatical and lexical cohesive devices are. then, to answer the questions all grammatical and lexical cohesive devices in reading comprehension passages from 6 units of 21units th...
An inch deep and a mile wide: Electronic tools for savvy administrators
Texas school administrators often lack vital knowledge of technology trends, issues and skills; therefore, they are not as effective leaders of technology introduction, integration, and management as are needed. This lack comes from three sources: 1) school administrator preparatory programs have not and do not provide technology-related courses; 2) there are few technology-related in-service t...
متن کاملanalysis of ruin probability for insurance companies using markov chain
در این پایان نامه نشان داده ایم که چگونه می توان مدل ریسک بیمه ای اسپیرر اندرسون را به کمک زنجیره های مارکوف تعریف کرد. سپس به کمک روش های آنالیز ماتریسی احتمال برشکستگی ، میزان مازاد در هنگام برشکستگی و میزان کسری بودجه در زمان وقوع برشکستگی را محاسبه کرده ایم. هدف ما در این پایان نامه بسیار محاسباتی و کاربردی تر از روش های است که در گذشته برای محاسبه این احتمال ارائه شده است. در ابتدا ما نشا...
15 صفحه اولذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Journal of Photopolymer Science and Technology
سال: 2020
ISSN: 0914-9244,1349-6336
DOI: 10.2494/photopolymer.32.763