Zinc hybrid sintering for printed transient sensors and wireless electronics
نویسندگان
چکیده
Abstract Transient electronics offer a promising solution for reducing electronic waste and use in implantable bioelectronics, yet their fabrication remains challenging. We report on scalable method that synergistically combines chemical photonic mechanisms to sinter printed Zn microparticles. Following reduction of the oxide layer using an acidic solution, zinc particles are agglomerated into continuous flash lamp annealing treatment. The resulting sintered patterns exhibit electrical conductivity values as high 5.62 × 10 6 S m −1 . durability traces enable biodegradable sensors LC circuits: temperature, strain, chipless wireless force sensors, radio-frequency inductive coils remote powering. process allows reduced energy be delivered substrate is compatible with temperature-sensitive polymeric cellulosic substrates, enabling new avenues additive manufacturing transient implants.
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ژورنال
عنوان ژورنال: npj flexible electronics
سال: 2023
ISSN: ['2397-4621']
DOI: https://doi.org/10.1038/s41528-023-00249-0