Hermetic cavities using gold wafer level thermocompression bonding
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چکیده
This paper presents the study of gold/gold thermocompression bonding at silicon wafer level. The first samples contains sealing rings and electrical pads, and are characterized on pull, and shear test showing bond strength similar to silicon/glass anodic bonding (10MPa-80MPa). A sealed cavity and a piezoresistor on a 30μm-thick silicon membrane are added in the second samples. Helium test, membrane deflection and piezoresistor signal monitoring after aging 14 days at 250°C confirm the vacuum stability inside the cavity after bonding.
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تاریخ انتشار 2017