A Novel Broadband Via Structure for Crosstalk Reduction in Dual Layered PCB for High Speed Data Transmission

In today’s era, two factors which are essential for an efficient Printed Circuit Board (PCB) design are high data transfer rate and structure miniaturization. This increase in information transfer rate is limited by the Bandwidth of the communication channel. Miniaturization can be achieved in PCBs by multiple layering. Vias are used as interconnects between the various layers within a multilayered PCB and are used for transitions of data from one layer to the next. This paper aims at increasing the bandwidth capacity of the Via structure and reducing the crosstalk for a two layered PCB structure for minimal signal loss.