High-Throughput Top-Down Fabrication of Uniform Magnetic Particles
نویسندگان
چکیده
Ion Beam Aperture Array Lithography was applied to top-down fabrication of large dense (10(8)-10(9) particles/cm(2)) arrays of uniform micron-scale particles at rates hundreds of times faster than electron beam lithography. In this process, a large array of helium ion beamlets is formed when a stencil mask containing an array of circular openings is illuminated by a broad beam of energetic (5-8 keV) ions, and is used to write arrays of specific repetitive patterns. A commercial 5-micrometer metal mesh was used as a stencil mask; the mesh size was adjusted by shrinking the stencil openings using conformal sputter-deposition of copper. Thermal evaporation from multiple sources was utilized to form magnetic particles of varied size and thickness, including alternating layers of gold and permalloy. Evaporation of permalloy layers in the presence of a magnetic field allowed creation of particles with uniform magnetic properties and pre-determined magnetization direction. The magnetic properties of the resulting particles were characterized by Vibrating Sample Magnetometry. Since the orientation of the particles on the substrate before release into suspension is known, the orientation-dependent magnetic properties of the particles could be determined.
منابع مشابه
High-resolution and large-area nanoparticle arrays using EUV interference lithography.
Well-defined model systems are needed for better understanding of the relationship between optical, electronic, magnetic, and catalytic properties of nanoparticles and their structure. Chemical synthesis of metal nanoparticles results in large size and shape dispersion and lack of lateral order. In contrast, conventional top-down lithography techniques provide control over the lateral order and...
متن کاملThickness-controlled Metal Nanoscale Etch for Proposed Metal Nanowires Fabrication
A novel nanoscale etch process of metallic structures, the metal peel-off method(MPOM), is developed. The etching area can be defined photolithographically on the exposed substrate. Utilizing galvanic displacement as well as selective etching process after photolithographic process, we simply and uniformly achieve self-controlled etch rate of 32.2±2.1nm/times through whole wafer level. MPOM pro...
متن کاملFabrication and Characterization of Novel Mixed Matrix Polyethersulfone Based Nanofiltration Membrane Modified by Ilmenite (TECHNICAL NOTE)
This study is focused on fabrication and characterization of mixed matrix poly ether sulfone based nanofiltration membrane by phase inversion method. The effect of different amounts of Ilmenite (FeTiO3) particles as inorganic filler additive in the casting solution on physic-chemical characteristics of membranes was studied. Scanning electron microscopy, surface analysis, water content, contact...
متن کاملCMOS-Compatible Top-Down Fabrication of Periodic SiO2 Nanostructures using a Single Mask
We propose a CMOS-compatible top-down fabrication technique of highly-ordered and periodic SiO2 nanostructures using a single amorphous silicon (α-Si) mask layer. The α-Si mask pattern is precisely transferred into the underlying SiO2 substrate material with a high fidelity by a novel top-down fabrication. It is the first time for α-Si film used as an etch mask to fabricate SiO2 nanostructures ...
متن کاملCombining Bottom-Up Self-Assembly with Top-Down Microfabrication to Create Hierarchical Inverse Opals with High Structural Order.
Colloidal particles can assemble into ordered crystals, creating periodically structured materials at the nanoscale without relying on expensive equipment. The combination of small size and high order leads to strong interaction with visible light, which induces macroscopic, iridescent structural coloration. To increase the complexity and functionality, it is important to control the organizati...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
عنوان ژورنال:
دوره 7 شماره
صفحات -
تاریخ انتشار 2012