Preliminary failure-mode characterization of emerging direct-lead-bonding power module. Comparison with standard wire-bonding interconnection
نویسندگان
چکیده
Article history: Received 25 May 2015 Accepted 8 June 2015 Available online xxxx
منابع مشابه
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عنوان ژورنال:
- Microelectronics Reliability
دوره 55 شماره
صفحات -
تاریخ انتشار 2015