RF TESTING AND MODELING OF WIRELESS COMMUNICATION DEVICES AND ICs
نویسندگان
چکیده
Rapid development of high frequency devices and IC technologies for wireless communication products created many opportunities and challenges in RF testing, packaging and modeling. In this paper we review these challenges and show trends in the test and modeling technologies to meet the demand. Different approaches for studying largesignal performance of high frequency circuits, incorporating wave-propagation effects, will also be illustrated. Analysis techniques are based on finite-difference time-domain, interpolating wavelets, genetic algorithms, and circuit-based schemes. A fully distributed equivalent circuit model for power transistors will be presented. Advantages and limitations of the various approaches will be discussed.
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تاریخ انتشار 2002