Fast Multi-Design Thermal-Aware Placement Planning for Reconfigurable Systems using Power Budgeting

In this paper, a novel multi-design thermal-aware dynamic placement planner for reconfigurable systems is presented, which targets transient temperature reduction. Rather than solving timeconsuming differential equations to obtain the hotspots, we propose a fast and accurate heuristic model based on power budgeting to plan the dynamic placements of a stream of design statically, while considering the boundary conditions. We provide detailed mathematical analysis of our model for power budgeting which highlights the effectiveness of our methodology. Based on our heuristic model, we have developed a fast optimization technique to plan the dynamic placements at design time. Our results indicate that our technique is two orders of magnitude faster while the quality of the placements generated in terms of temperature and interconnection overhead is the same, if not better, compared to the thermal-aware placement techniques which perform thermal simulations inside the search engine.