Trends in RF & Wireless Packaging
نویسندگان
چکیده
This paper overviews the RF&Wireless packaging trends and introduces the four major impact areas Methodology and systems modeling , Board, assembly and housing, Prototyping, processing and production, Characterization on hand of real life examples. As an outview the major present trend of heterointegration and the picture of packaging waves is used to look into near future.
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تاریخ انتشار 2004