Development of Highly Integrated 3D Microwave - Millimeter Wave Radio Front-End System-on-Package (SOP)

We present the development, implementation and measurement of a 3D-deployed RF front-end System-onPackage (SOP) topology in a standard low-loss multi-layer ceramic (LTCC) technology. A compact 14 GHz GaAs MESFETbased satellite transmitter integrated with a low-loss embedded filter for outdoor units were built on a 400 × 310 × 35.2 mil3 943AT tapes. The LTCC stripline filter exhibits a measured maximum insertion loss of 1.8 dB while the entire transmitter chain yields a 32-34 dB of gain in the 13.5 to 14.5 GHz range. These results suggest the feasibility of building highly SOP integrated microwave and millimeter wave radio front ends. In addition, a highly integrated transceiver module for OFDM Communication System using Multilayer Packaging technology as well as Multilayer Integrated Passives using Fully Organic SOP technology demonstrate the capabilities of SOP for other applications such as the OFDM Wireless LAN and LMDS.