3-d Self-assembly of Opto-mechanicalstructures Using Bonded Silicon-on-insulator
نویسنده
چکیده
A low-temperature process for mass-parallel self-assembly of three-dimensional micro-opto-electro-mechanical systems is described. The devices are fabricated by dry etching of bonded silicon-on-insulator wafers, and selfassembled by out-of plane rotation powered by a surface tension torque obtained by melting thick pads of photoresist. Fixed optical mirrors oriented at 45û and 90û to the substrate are demonstrated, and electrostatically-driven resonant torsion mirror scanners with a wide angle of deflection are described.
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تاریخ انتشار 2002