Dedicated thermal emulator for analysis of thermal coupling in many-core processors
نویسندگان
چکیده
This paper discusses the problem of thermal coupling in many-core processors manufactured in nonplanar FinFET technologies. Our work focuses on two research goals. Firstly, the results obtained from the thermal simulations allow the investigation of mutual thermal influence between neighboring cores in such processors, what can be used to develop thermal models of such architectures. Secondly, we describe a test integrated circuit designed specifically to mimic the thermal behavior of microprocessors manufactured in various technologies. In particular, this paper describes its design and presents selected simulation results obtained using Green's function-based thermal software. & 2014 Elsevier Ltd. All rights reserved.
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عنوان ژورنال:
- Microelectronics Journal
دوره 45 شماره
صفحات -
تاریخ انتشار 2014