The minimum of thermal resistance design of high power LED package

This paper reports on the thermal characteristics of the high power light emitting diode (LED) package and numerical optimal analysis is used to design the size of the LED package for the purpose of improving the heat dissipation. The simplified conjugate-gradient method (SCGM) is adopted to combine with the finite element method (FEM) to optimize the shape of the heat sink inside the LED package. SCGM is used to change the value of variables and to call the finite element package, COMSOL, to obtain the results. The results show that the shape of slug changing directly affects the temperature profile of the LED. The heat generated from die can be removed more by the slug. It is obvious that the proposed method is effective on thermal optimization of the LED package.