N. Hatami,

[ 1 ] - MODELING SURFACE TENSION AND WALL ADHESION IN MOLD FILLING PROCESS

Abstract: In this study an algorithm for mold-filling simulation with consideration of surface tension has been developed based on a SOLA VOF scheme. As the governing equations, the Navier-Stokes equations for incompressible and laminar flows were used. We proposed a way of considering surface tension in mold-filling simulation. The proposed scheme for surface tension was based on the conti...

نویسندگان همکار