Recent developments in grinding have opened up new avenues for finishingof hard and brittle materials with Nano-surface finish, high tolerance and accuracy.Grinding with super abrasive diamond wheels is an excellent way to produce ultraprecision surface finish. However, super abrasive diamond grits need higher bondingstrength while grinding, which metal-bonded grinding wheels ca...

conputer pror,rae1 descrihed for practical optinization plun?;e grindin>; on steels. Tl1e program based on a strategy desiv,ned to o;Hi!'1ize both the grinding and dress "~nr, <Jara!'1eters maxil'1um metal removal rate, to constraints of surface finish and burning of the Forkpiece. The operates with a desktop micro-computer. performin?: the optimization, the user inputs the present grinding dre...

One of the factors which are usually difficult to be measured in mills is the grindability and distribution of feed under real situation and in a short time. In the condition of achieving a fast and convenient way to determine these parameters, the proper relationship between energy, hardness and particle size distribution can be obtained. Feed hardness is one of the most important factors in g...

A on-line monitoring new method for grinding quality is presented based on theory analysis and test study, which collects the information of grinding quality from the AE signals produced by friction and grinding process to realize the on-line intelligent detection and prediction of grinding quality by A wavelet neural network & Fuzzy BP algorithm based network. The reliability and feasibility o...

The majority of semiconductor devices are built on silicon wafers. Manufacturing of high quality silicon wafers involves several machining processes including grinding. This review paper discusses historical perspectives on grinding of silicon wafers, impacts of wafer size progression on applications of grinding in silicon wafer manufacturing, and interrelationships between grinding and two oth...

This paper investigates the production of a micronized muscovite to target product size d50~15 µm with minimum energy consumption suit requirements paint industry by dry grinding process in laboratory-scale vertical stirred ball mill. A series batch tests were conducted without and two commonly used industrial liquid aids, ethylene glycol (EG, C2H6O2) triethanolamine (TEA, C6H15NO3). The result...

The improved cylindrical wet grinding temperature (ICWGT) model considering the lubrication effect of fluid is established and solved numerically. In doing so, Newton–Raphson method used to solve hydrodynamic pressure fluid, fast Fourier transform (FFT) employed accelerate deformation calculation. Furthermore, convective heat transfer coefficient (CHTC) calculated based on theory, moving source...

The bone drilling temperature fields under different cutting parameters and cooling modes were experimental researched by using common twist drill, diamond punching pin, diamond bullet-like grinding head and diamond spherical grinding head. Three cooling modes were applied, namely, natural air cooling, normal saline pouring cooling and normal saline spray cooling. K-thermocouple was used to mea...

In this investigation, experiments were carried out to understand the influence of various grinding parameters like wheel speed, workspeed and depth of cut on the grinding temperature at the surface of the Al-SiCP composite workpiece with different grinding wheels. The temperature distribution within the workpiece was studied by simulating the grinding process and using finite element analysis ...