With embedded sensors, the structures are capable of monitoring parameters at such critical locations not accessible to ordinary sensors. Recently, fiber optic sensor emerges as one promising technology to be integrated with structures. Embedding of fiber optic sensors into composites and some metals, especially those with low melting points, have been reported. However, all reported embedding ...

This paper aims to measure and simulate the warpages of 3D through-silicon via (TSV) die-stacked dynamic-random-access-memory (DRAM) packages during the manufacturing process. The related die stresses and keep-out zone (KOZ) for the stacked dies in the packages at room temperature are further calculated with the validated simulation model. The out-of-plane deformations (or warpages) of the pack...

This paper deals with the simulation of power electronic components. More precisely it is focused on the modeling approach to emphasize the electro-thermomechanical behavior of materials in power electronics assembly (electronic package). Thermal strains and Stresses constitute an important part of the design considerations for many practical engineering problems. They become especially critica...

Thermal residual stresses exist within a body in the absence of external loading or thermal gradients. Processing of the composites often involves cooling from higher temperature resulting in thermal residual stresses in the matrix due to restraint imposed by reinforcements. Thermal residual stresses determinately affect the properties of materials thereby shortening their lifetime. These resid...

The effects of applied tensile stresses on the temperature dependence of 10 MHz ultrasonic longitudinal velocity have been studied in three types of commercial aluminum alloys, 6064-T4, 2024-T351, and 3003-T251. In all measurements, it is found that the velocity decreases linearly with temperature, and the slope of the linear relationshi'p changes considerably as a function of applied tensile s...

Aluminum reinforced by 60 vol.% diamond particles has been investigated as a potential heat sink material for high power electronics. Diamond (CD) is used as reinforcement contributing its high thermal conductivity (TC 1000 W mK ) and low coefficient thermal expansion (CTE 1 ppm K ). An Al matrix enables shaping and joining of the composite components. Interface bonding is improved by limited c...

Binding of heat shock factors (HSFs) with heat shock element sequence is critical for the transcriptional induction of heat shock genes. Rice genome sequence shows 26 OsHsf genes out of which 25 possess various important domains noted in HSFs i.e. DNA binding domain (DBD), oligomerization domain (OD), nuclear localization signal (NLS), nuclear export signal (NES) and AHA type activation domain....

Abiotic stresses such as extremes of temperature and pH, high salinity and drought, comprise some of the major factors causing extensive losses to crop production worldwide. Understanding how plants respond and adapt at cellular and molecular levels to continuous environmental changes is a pre-requisite for the generation of resistant or tolerant plants to abiotic stresses. In this review we ai...