This paper presents a performance-driven I/O pin routing algorithm with special consideration of wire uniformity. First, a topological routing based on min-cost max-flow algorithm is proposed. In this phase, an exponential weight function is used to guide the flow distribution which is very helpful in distributing wires, globally and uniformly, on the whole routing area. Then a physical routing...

INSTRUCTIONS The diameter of silicon wafer becomes larger in order to increase the number of chips per one wafer. For such a larger diameter silicon ingot is mainly sliced by using multi-wire method, in which a long thin wire is used with slurry. In this method, several hundreds of wafers could be sliced at the same time. However there are still problems remained, such as large cracks, slurry t...

The aim of this study was to analyse the peel resistance of silver plated wires examined in an intraoral setting. In this study, a 0.016 × 0.016 inch silver plated stainless steel wire and a 0.016 × 0.016 inch Teflon-coated nickel-titanium wire were investigated. The brackets of ceramic and stainless steel were bonded to the first and second bicuspids of two subjects. We investigated peel resis...

in this study, changes in speed and turbulence intensity in the wake of a peugeot model and the drag coefficient changes with increases vehicle speed in unsteady flow measured and evaluated. the blow open circuit wind tunnel to simulate fluid flow is used. disturbances and nominal maximum speed of the device, respectively is, 30 m / s and 0.01%. has been continuously increasing speed by an inve...

the static strain aging is a phenomenon that can change the mechanical properties of low carbon steels. thus, the static strain aging behavior of low carbon steel wires after drawing process is studied. to do so, the wires are austenitized at different temperatures and cooled in different rates. then the wires are drawn and aged at a specific temperature and time. before and after aging of each...

This paper introduces a wire-frame method for the generation of blending surfaces. It is a numerical approach to the design of surfaces that smoothly join two or more given surfaces. The blending surface generated by the wire-frame method is composed of a set of bicubic patches in parametric forms. The wire-frame method first constructs a set of wire-frames. Each element of the wire-frame is mo...

Single wire experiments were performed on a low current pulse generator at Cornell University. A 220 nF capacitor charged to 15–25 kV was used to drive single wire experiments. The capacitor and wire holder were connected in series through an external variable inductor to control the current rise rate. This external series inductance was adjustable from 0.2 to 2 mH. When coupled with the range ...

Wire electro-discharge machining (WEDM) is a fully extended and competitive machining process widely used for hard and difficult to machine materials. In the present research, experimental investigation have been conducted to find out the wire wear rate at different machining parameter Such as peak current, pulse on time, pulse off time, based on full factorial design of experiment. Molybdenum ...

Direct microjoining using Yttrium-Aluminium-Garnet (YAG) laser beams of copper wire and a plate or substrate board was carried out. The control of the behavior of the molten wire was extremely important to prevent joining defects such as evaporation or constriction of the wire. Both the contact angle between the wire and the plate and the distance from the tip of the wire to the laser irradiati...