package technology and its design challenges E. D. Blackshear M. Cases E. Klink S. R. Engle R. S. Malfatt D. N. de Araujo S. Oggioni L. D. LaCroix J. A. Wakil G. G. Hougham N. H. Pham D. J. Russell This paper reviews sequential build-up (SBU) laminate substrate development from its beginning in 1988. It reports on developments in this technology for IBM applications since its adoption in 2000. ...

Ability to stack separate chips in a single package enables three-dimensional integrated circuits (3D ICs). Heterogeneous 3D ICs provide even better opportunities to reduce the power and increase the performance per unit area. An important issue in designing a heterogeneous 3D IC is reliability. To achieve this, one needs to select the data mapping and processor layout carefully. In this paper,...

This paper presents our effort to predict IC, packaging, and board level reliability problems. Micro-electronic based reliability problems are driven by the mismatch between the different material properties, such as thermal expansion, hygro-swelling, and/or the degradation of interfacial strength. In the past, such reliability problems were treated separately, but recent development have made ...

Surface mount multilayer ceramic capacitors (MLCCs) are one of the most common components found on modern circuit card assemblies. Introduced in 1977, they are well known for their reliability and have been rapidly accepted by the electronics industry. The reliability of a nominal MLCC is extremely high, with expected operating lifetimes in the decades, if not hundreds of years. However, to att...

As CMOS scaling continues, the traditional DC device-level hot-carrier reliability criteria becomes difficult to meet for newer generations of technology. In order to satisfy hot-carrier reliability requirements by using AC circuit-level criteria, issues of AC device degradation under circuit operation and impact of device degradation on circuit performance need to be examined. In order to sati...

Maintaining inter-node connectivity is of a paramount concern in most applications of mobile sensor/actor networks because nodes have to report their data and coordinate their operations. Failure of a node may partition the inter-node network into disjoint segments, and may thus hinder data delivery and inter-node coordination. This article presents a novel resource efficient connectivity resto...

Modern electronics typically consist of microprocessors and other complex integrated circuits (ICs) such as FPGAs, ADCs, and memory. They are susceptible to electrical, mechanical and thermal modes of failure like other components on a printed circuit board, but due to their materials, complexity and roles within a circuit, accurately predicting a failure rate has become difficult, if not impos...

Generally, the failure rate and the repair time of system components are constant parameters in reliability assessment of electric distribution systems. A failure of component is resulted from failing in the operation or overloading. In addition, there exist cases where, the repair times of components are small and tolerable from customer point of view. Thus, tolerable repair times may be overl...

Reliability assessment is an important part of the design process of digital integrated circuits. We observe that a common thread that runs through most causes of run-time failure is the extent of circuit activity, i.e., the rate at which its nodes are switching. We propose a new measure of activity, called the transition density, which may be de ned as the \average switching rate" at a circuit...

BACKGROUND High order modulation and demodulation technology can solve the frequency requirement between the wireless energy transmission and data communication. In order to achieve reliable wireless data communication based on high order modulation technology for visual prosthesis, this work proposed a Reed-Solomon (RS) error correcting code (ECC) circuit on the basis of differential amplitude...