نتایج جستجو برای: intermetallic

تعداد نتایج: 3769  

2004
W H Jiang

The present work demonstrates that friction stir welding (FSW) is a feasible route for joining 6061 aluminium (Al) alloy to AISI 1018 steel. The weld has a good weld quality and is free of cracks and porosity. The tensile failure happened at the boundary between the nugget and thermomechanically affected zone of the base Al alloy, indicating that the weld has a higher joining strength. Despite ...

2017
Y. Xu L. Scott Chumbley G. A. Weigelt

The diffusion characteristics of Mg–rare-earth diffusion couples were studied. Cylinders of pure Mg and rare earth (Dy, Nd, and Pr) were abutted and annealed at 500 °C for 100 h or 300 h. Point-by-point composition profiles were collected starting in pure Mg, across the diffusion zone, and ending in the pure rare earth, using energy dispersive x-ray spectroscopy with a scanning electron microsc...

2010
R. Escalera-Lozano

The role of Mg2Si in the electrochemical behavior of Al-Si-Mg aluminum alloys has been studied using four experimental aluminum alloys with variations in the Si/Mg molar ratio (A1-0.12, A2-0.49, A3-0.89, A4-1.05), in neutral aerated 0.1M NaCl solutions. Accordingly, the corrosion potential in open circuit (Eoc) and polarization resistance (Rp) were measured. Results show that the augment in Si/...

2015
Piotr Matysik Stanisław Jóźwiak Tomasz Czujko

Fe-Al intermetallic alloys with aluminum content over 60 at% are in the area of the phase equilibrium diagram that is considerably less investigated in comparison to the high-symmetry Fe₃Al and FeAl phases. Ambiguous crystallographic information and incoherent data referring to the phase equilibrium diagrams placed in a high-aluminum range have caused confusions and misinformation. Nowadays une...

Journal: :Bulletin of the Japan Institute of Metals 1989

Journal: :International Journal of Computer Science, Engineering and Applications 2014

Journal: :Microelectronics Reliability 2008
C. J. Hang C. Q. Wang M. Mayer Y. H. Tian Y. Zhou H. H. Wang

Copper wires are increasingly used in place of gold wires for making bonded interconnections in microelectronics. There are many potential benefits for use of copper in these applications, including better electrical and mechanical properties, and lower cost. Usually, wires are bonded to aluminum contact pads. However, the growth of Cu/Al intermetallic compounds (IMC) at the wire/pad interfaces...

2016
T. Zhang Y. - H. Zhao

In order to confine the aqua-eutrophication problem arising from phosphorus pollution, many municipal wastewater treatment plants have to improve their executive drainage standard for total phosphorus (TP). In this study, a municipal wastewater treatment plant employing modified Carrousel oxidation ditch as main biological treatment unit was selected as a representative case. Technical necessit...

2005
Qiang YU

In this paper the authors have investigated the thermal fatigue reliability of lead-free solder joints. They have focused their attention to the formation of the intermetallic compound and its effect on the initiation and propagation behaviors of fatigue cracks. Furthermore, they also studied the effect of voids in the solder joints on the fatigue reliability. An isothermal fatigue test method ...

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