نتایج جستجو برای: intermetallic

تعداد نتایج: 3769  

2014
Marc Armbrüster Robert Schlögl Yuri Grin

The application of intermetallic compounds for understanding in heterogeneous catalysis developed in an excellent way during the last decade. This review provides an overview of concepts and developments revealing the potential of intermetallic compounds in fundamental as well as applied catalysis research. Intermetallic compounds may be considered as platform materials to address current and f...

2017
Qing Zhou Jian Wang Amit Misra Ping Huang Fei Wang Kewei Xu

Intermetallic precipitates are widely used to tailor mechanical properties of structural alloys but are often destabilized during plastic deformation. Using atomistic simulations, we elucidate structural instability mechanisms of intermetallic precipitates associated with dislocation motion in a model system of Al2Cu. Interaction of non-coplanar <001> dislocation dipoles during plastic deformat...

2018
Fabian C. Gladisch

The quest for solid-state materials with tailored chemical and physical features stimulates the search for general prescriptions to recognize and forecast their electronic structures providing valuable information about the experimentally determined bulk properties at the atomic scale. Although the concepts first introduced by Zintl and Hume–Rothery help to understand and forecast the bonding m...

Journal: :روش های عددی در مهندسی (استقلال) 0
مهدی صالحی m. salehi

in this research, tribological behavior of ti-ni-p intermetallic coatings on titanium substrates have been investigated under dry reciprocating conditions. hardness profile testing results exhibit that high surface hardness has been attained and static indentation result shows that the intermetallic coating has better adhesion strength than the conventional ceramic coatings. in this respect, th...

2008
A. Jalar M. F. Rosle M. A. A. Hamid

There are several issues related to the mechanical and electrical wirebond failure during wirebonding process. Major factors are associated with AuAl intermetallic system. AuAl intermetallic compounds (IMC) can easily form at room temperature and can be accelerated with the elevated temperature. In this paper, pattern of intermetallic compounds growth and potential degradation due to voids in t...

Journal: :Microelectronics Reliability 2009
S. M. Hayes N. Chawla D. R. Frear

Increasing environmental concerns and pending government regulations have pressured microelectronic manufacturers to find suitable alternatives to Pb-bearing solders traditionally used in electronics packaging. Over recent years, Sn-rich solders have received significant attention as suitable replacements for Pbbearing solders. Understanding the behavior of intermetallics in Sn-rich solders is ...

2016
Yulin Liu Gaoren Huang Yimeng Sun Li Zhang Zhenwei Huang Jijie Wang Chunzhong Liu

Mn was an important alloying element used in Al-Mg-Mn alloys. However, it had to be limited to a low level (<1.0 wt %) to avoid the formation of coarse intermetallics. In order to take full advantage of the benefits of Mn, research was carried out to investigate the possibility of increasing the content of Mn by studying the effect of cooling rate on the formation of Fe- and Mn-rich intermetall...

2017
Boyuan Huang Chunyan Song Yang Liu Yongliang Gui

Intermetallic compounds have been studied for their potential application as structural wear materials or coatings on engineering steels. In the present work, a newly designed intermetallic composite in a Ni-Mo-Si system was fabricated by arc-melting process with commercially pure metal powders as starting materials. The chemical composition of this intermetallic composite is 45Ni-40Mo-15Si (at...

2015
Quoc Manh Nguyen Shyh-Chour Huang

Butt joints of A5052 aluminum alloy and SS400 steel, with a new type of chamfered edge, are welded by means of metal inert gas welding and ER4043 Al-Si filler metal. The microhardness and microstructure of the joint are investigated. An intermetallic layer is found on the surface of the welding seam and SS400 steel sheet. The hardness of the intermetallic layer is examined using the Vickers har...

2006
Brook Chao Seung-Hyun Chae Xuefeng Zhang Kuan-Hsun Lu Min Ding Paul S. Ho

A kinetic analysis was formulated for electromigration enhanced intermetallic evolution of a Cu–Sn diffusion couple in the Sn-based Pb-free solder joints with Cu under bump metallurgy. The simulated diffusion couple comprised the two terminal phases, Cu and Sn, as well as the two intermetallic phases, Cu3Sn and Cu6Sn5, formed between them. The diffusion and electromigration parameters were obta...

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