Lithographically fabricated iridium-based mercury microelectrode arrays are shown to be very suitable for adsorptive stripping measurements of trace nickel in the presence of the dimethylgloxime complexing agent. Variables affecting the response have been assessed and optimized. The sensor optimization has resulted in a favorable and highly stable response, with good linearity and precision (RS...

An experimental investigation into material transfer and wear has been performed for the case of a ferrite probe sliding at high speeds (between 25 cm/set and 1250 cm/set) and low loads (10 gm) on a steel disk, a nickel plated disk, and a polymercoated disk, the latter containing finely dispersed abrasive particles. Autoradiographic methods together with microdensitometer analysis have been app...

Developing a better method for the metallization of silicon solar cells is integral part of realizing superior efficiency. Currently, contact realization using screen printing is the leading technology in the silicon based photovoltaic industry, as it is simple and fast. However, the problem with metallization of this kind is that it has a lower aspect ratio and higher contact resistance, which...

Many etiologies are held accountable for nasal septum perforations. Topical nasal drug usage, previous surgeries, trauma, nose picking, squamous cell carcinoma, some rheumatological disorders such as granulomatosis with polyangiitis (Wegener granulomatosis), some infectious diseases such as syphilis and leprosy are among the causes of the perforations. Occupational heavy metal exposures by inha...

Article history: Received 28.3.2013 Received in revised form 26.4.2013 Accepted 29.4.2013 Aluminum matrix composites containing 55% SiC particle reinforcing phase/SiC reinforcement phase particle and Kovar alloy 4J29 were chosen as the base metals. After nickel plating on the surface of SiCp/Al, two kinds of materials were soldered together by using Zn-Cd-Ag-Cu as the filler metal and ZnCl2 as ...

This paper presents the different processing steps of a new generic surface micromachining module for MEMS hermetic packaging at temperatures around 180°C based on nickel plating and photoresist sacrificial layers. The advantages of thin film caps are the reduced thickness and area consumption and the promise of being a lowcost batch process. Moreover, sealing happens by a reflow technique, giv...