نتایج جستجو برای: lapping

تعداد نتایج: 430  

Journal: :international journal of advanced design and manufacturing technology 0
mohammad sajjad mahdieh university of tehran (ut) ehsan rafati islamic azad university najafabad branch, iran samaneh kargar sichani isfahan university of technology (iut), iran

surface roughness of engineering parts is very significant property that effectively influences on the wear and fatigue strength. there are many methods for improving surface quality of engineering parts such as grinding, lapping and honing. one of the methods for improving surface quality is roller burnishing. roller burnishing improves surface quality of engineering parts by means of cold wor...

Journal: :Engineering Structures 2022

The seismic behaviour of reinforced concrete structures built with plain reinforcing bars is sometimes conditioned by the slippage between and surrounding in elements as exterior beam-column joints. anchorage beam core joint weak confinement, inappropriate reinforcement detailing for loads poor bond properties are common reasons collapse many structures. This paper presents results four unidire...

1999
David A. Dornfeld

New demands are being placed on monitoring systems in precision manufacturing because of recent developments and trends in machining technology and machine tool design. This paper first discusses the requirements for sensor technology for precision manufacturing process monitoring in general. Then, background and details are given about acoustic emission (AE) and the application of AE sensing t...

2003
Eric P. Xing Michael I. Jordan Stuart J. Russell

We present a class of generalized mean field (GMF) algorithms for approximate inference in exponential family graphical models which is analogous to the generalized belief prop­ agation (GBP) or cluster variational meth­ ods. While those methods are based on over­ lapping clusters, our approach is based on nonoverlapping clusters. Unlike the cluster variational methods, the approach is proved t...

2000
L. Wang C. C. G. Visser C. de Boer M. Laros W. van der Vlist J. Groeneweg G. Craciun P. M. Sarro

 Thinning of micromachined wafers containing trenches and cavities to realize through-chip interconnects is presented. Successful thinning of wafers by lapping and polishing until the cavities previously etched by deep reactive ion etching are reached is demonstrated. The possible causes of damage to the etched structures are investigated. The trapping of particles in the cavities is studied a...

Journal: :Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture 2001

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