This paper presents the different processing steps of a new generic surface micromachining module for MEMS hermetic packaging at temperatures around 180°C based on nickel plating and photoresist sacrificial layers. The advantages of thin film caps are the reduced thickness and area consumption and the promise of being a lowcost batch process. Moreover, sealing happens by a reflow technique, giv...

As the laminate substrate industry moves from Hot Air Solder Level (HASL) finishes, alternate plating finishes are being proposed such as immersion gold/electroless nickel, electroless palladium and electroless silver. This paper presents results of an evaluation of the thermosonic gold ball wire bondability of electroless palladium. Two palladium thicknesses, with and without a nickel underlay...

The large volumes of water used in rinsing operations in the plating industry may contain cyanides, chromium, nickel, and zinc, resulting in a substantial loss of valuable plating chemicals. From an economic viewpoint, particular consideration should be given to measures that will permit recovery of chemicals and water for reuse. In view of the wide variety of conditions found in plating practi...

In this study removal of nickel(II) from aqueous solutions by adsorption on to Palmyra palm fruit seed carbon (PPFSC) and commercial activated carbon (CAC) was investigated as a function of agitation time, pH, and carbon dosage on the adsorption capacity has been studied. The metal adsorption yields increased with the increasing adsorbent dosage and contact time and reached to equilibrium for b...