The first solution for addressing this new wire bonding challenge was the matte finish. Along with some geometrical capillary tip modifications, such as the double internal chamfer (IC), these changes proved Cu wire to be a reliable substitute to gold (Au). However, while the welding requirements were achieved, the tool’s resistance to wear deteriorated. This was expected as the hardness of Cu ...

We present a new technique of direct measurement of wire tensions in wire chambers. A specially designed circuit plucks the wire using the Lorentz force and measures the frequency of damped transverse oscillations of the wire. The technique avoids the usual time-consuming necessity of tuning circuit parameter to a resonance. It allows a fast and convenient determination of tensions and is strai...

Wire saw, with its ability to cut very thin wafers from large diameter crystalline ingots of semiconductor materials, has emerged as a leading technology for wafer production in semiconductor and photovoltaic industry. Nevertheless, the wire saw cutting process remains lacking a theoretical methodology and is not properly understood. The modern times compulsion of more accurate and efficient ma...

in this paper, considering the importance of incoming flow turbulence intensity into combustion chamber, tripping wire effect on the flow wake has been experimentally investigated within a linear compressor cascade. to do this, two wires were implemented along each blade and their effects on average velocity, turbulence intensity and vortices frequencies at reynolds number 45500 were accurately...

In this paper, two issues about wire width are investigated. The first one is that “Is the minimum wire width under the minimum wire pitch for a process technology good enough from the perspective of timing performance?” The second is that “Is delay sensitive to wire width variation around the optimal width?” We find that the answer to the first issue is “yes”, whereas the answer to the second ...

The reliability of the IC chip during performance of its function in any application is very much dependant on the quality of the wire bond interconnection. If the quality of the wire bond interconnection is poor and not consistent, it has a significant impact on the reliability and dependability of the device. The quality of a wire bond is determined by the strength of the interfaces between t...

Wire breakage and migration is a known complication of using a wire tension band construct to treat displaced patella fractures. We report a case of a broken K-wire that migrated from the patella completely into the proximal tibia without complication 9 years after the index surgery. This report highlights the fact that wire migration can occur long after fracture healing and be relativel...

Nonconventional machining technologies have been found viable to manufacture various products from a wide range of engineering materials. Wire electric discharge (WEDM), also known as Wire-EDM, is one the important thermal type nonconventional technologies. Wire-EDM being preferably used by manufacturers produce biomedical devices including bio and dental implants. This paper presents an overvi...

Childhood cancer has been modestly associated with wire codes, an exposure surrogate for power frequency magnetic fields, but less consistently with measured fields. We analyzed data on the population distribution of wire codes and their relationship with several measured magnetic field metrics. In a given geographic area, there is a marked trend for decreased prevalence from low to high wire c...