wo trends call into question the current practice of fabricating microprocessors and DRAMs as different chips on different fabrication lines. The gap between processor and DRAM speed is growing at 50% per year; and the size and organization of memory on a single DRAM chip is becoming awkward to use, yet size is growing at 60% per year. Intelligent RAM, or IRAM, merges processing and memory into...

Modern DRAM technologies o er power management features for optimization between performance and energy consumption. This paper employs Petri nets to model and evaluate memory controller policies for manipulating multiple power states. The model has been validated against the analysis and simulation used in our previous work. We extend it to model more complex policies and our results show that...

Reducing DRAM Row Activations with Eager Writeback

A general-purpose 3D-LSI platform technology for a high-capacity stacked memory integrated on a logic device was developed for high-performance, power-efficient, and scalable computing. SMAFTI technology [1-5], featuring an ultra-thin organic interposer with high-density feedthrough conductive vias, was introduced for interconnecting the 3D stacked memory and the logic device. A DRAM-compatible...

The Problem: The extent of previous work on processor in memory systems using merged DRAM-logic process technology [1, 2, 3, 4] indicates that the technology has great promise. Most of the results to date, however, have been architectural studies with simulation results or proposed architectures. Relatively few designs make it to final silicon due to the prohibitively high Non-Recurring Enginee...

42 Computer A Survey of Storage Options I f you were a personal computing enthusiast in 1984, you could buy an IBM PC for $5,000 to $6,000—about $8,000 to $9,500 in today's currency. For this you would get a 0.004-GHz 8-bit processor with 0.064 Mbytes of RAM, a 12-inch monochrome text-only display, a 0.16-Mbyte floppy drive, and no possibility of a hard drive. Compare that with a PC purchase to...

This paper aims to empirically evaluate the extent to which the 1986 Semiconductor Trade Arrangement (STA) affected the Japanese producers’ behavior and thus the evolution of the markets for the 256K and the 1M Dynamic Random Access Memory (DRAM) chips. We find that overall the STA facilitated the collusive behavior of the Japanese producers even beyond the myopic optimization: during the STA p...