Through silicon via (TSV) offers a promising solution for the vertical connection of chip I/O, which enables smaller and thinner package sizes cost-effective products by using wafer-level packaging instead chip-level process. However, TSV leakage has become critical concern in BEOL In this paper, Cu-fulfilled via-middle with 100 µm depth embedded 0.18 CMOS process sensor application is presente...

Chip scale package (CSP) technology offers promising solutions to package power device due to its relatively good thermal performance among other factors. Solder thermal interface materials (STIMs) are often employed at the die bond layer of a chip-scale packaged power device to enhance heat transfer from the chip to the heat spreader. Nonetheless, the presence of voids in the solder die-attach...

in this study, effect of two genotype imputation strategies, relatedness between reference panel and test populations and minor allele frequency on imputation error rate were examined with using a stochastic simulated population. reference panel and test populations were composed of 1,000 and 500 individuals, respectively. individuals in the reference panel were genotyped with using a high and ...

Reconstructing a surface from sparse sensory data is a well-known problem iIi computer vision. This paper describes an experimental analog VLSI chip for smooth surface interpolation from sparse depth data. An eight-node ID network was designed in 3J.lm CMOS and successfully tested. The network minimizes a second-order or "thinplate" energy of the surface. The circuit directly implements the cou...

The concept of Minimum Depth of Cut (MDC) is that the depth of cut must be over a certain critical thickness before any chip is formed. It is actually a major limiting factor on achievable accuracy in nanomachining, because the generated surface roughness is primarily attributed to the ploughing process when the uncut chip thickness is less than the MDC. This paper presents an analysis of a cut...

In this research work the tool-chip interface temperature is measured experimentally during turning of EN-31 steel alloy with tungsten carbide inserts using a tool-work thermocouple technique. First and secondorder mathematical models are developed in terms of machining parameters by using the response surface methodology on the basis of the experimental results. The results are analyzed statis...

The main aim of this paper is to study the material removal phenomenon using the finite element method (FEM) analysis for orthogonal cutting, and the impact of cutting speed variation on the chip formation, stress and plastic deformation. We have explored different constitutive models describing the tool-workpiece interaction. The Johnson-Cook constitutive model with damage initiation and damag...

Electrical Discharge Machining (EDM) process is one of the most widely used methods for machining. This method is used to form parts that conduct electricity. This method of machining has used for hard materials and therefore selects the correct values of parameters which are so effective on the quality machining of parts. Reaching to optimum condition of the DIN1.2080 alloy (D3) machining is v...