This review outlines the development of electroless Ni–P composite coatings. It highlights the method of formation, mechanism of particle incorporation, factors influencing particle incorporation, effect of particle incorporation on the structure, hardness, friction, wear and abrasion resistance, corrosion resistance, high temperature oxidation resistance of electroless Ni–P composite coatings ...

By simply supporting carbon nanotubes with a metal substrate of a redox potential lower than that of the metal ions to be reduced into nanoparticles, we have developed a facile yet versatile and effective substrate-enhanced electroless deposition (SEED) method for functionalizing nanotubes with a large variety of metal nanoparticles, including those otherwise impossible by more conventional ele...

The importance of microscopic morphological control to metal electroand electroless deposition in several emerging technologies is discussed. The use of in situ optical probes of the morphological development of deposits is described. A number of these are reviewed to describe both the potential of each method and the available literature on studies of electroand electroless deposition. Include...

this paper focused on a novel method of electroless plating ruthenium (ru) on solid or porous substrates like porous stainless steel (pss) discs or ceramic tubes. a novel complexing plating bath of ru was developed. it is proven that ru can be deposited directly on these substrates by the bath at a temperature of 328 k and strong alkaline environment. tga, sem, edx and xrd confirmed the success...

Flip Chip (FC) Technology is gaining an increased level of importance for a variety of applications based on Flip Chip on Board or Flip Chip in Package. The first driving force for the introduction of this Technology was the need to achieve increased speed and performance along with higher I/O count. A breakthrough, however, will be the use of flip chip due to cost reduction. For this aim it is...

In this talk, we report a research work on fabrication and metallization of high aspect ratio polymer microstructures fabricated using UV lithography of SU-8 on silicon substrate. Electroless plating of metal film on both the top and sidewall surfaces of microstructures were achieved while the silicon substrate was not plated. The primary chemical mechanisms and possible applications were also ...

ni-p and ni layers multilayer coatings were applied to az31 magnesium alloy utilizing electroless and electrodeposition procedures. the aim of the project was to decrease cracks and increase corrosion resistance of the coatings. in order to compare the coatings, the effect of single layer electroless ni-p coatings with different thicknesses was also investigated. the microstructure and phase co...

This paper focused on a novel method of electroless plating ruthenium (Ru) on solid or porous substrates like porous stainless steel (PSS) discs or ceramic tubes. A novel complexing plating bath of Ru was developed. It is proven that Ru can be deposited directly on these substrates by the bath at a temperature of 328 K and strong alkaline environment. TGA, SEM, EDX and XRD confirmed the success...

Very often electroless electrolytes contribute to wastewater treatment problems. These electrolytes are used in electroless plating processes, which contain a variety of chemicals to meet special surface treatment requirements. Metal salts produce the base material for metal deposition and hypophosphite is delivering the electrons for the metal reduction process – it is basically the internal e...