In this paper, hexamethyltetramine is introduced into the electroplating bath to improve surface morphology of electrodeposited copper. The cyclic voltammetry (CV) and dynamic polarization curves are used study effect Cu(Ⅰ) on electrochemical behaviors solution. After implementing copper experiment, scanning electron microscope (SEM) X-ray diffraction (XRD) explore influence Surface crystal pla...

Abstract Diffusion mechanism in between thin electroplated Zn coating and Cu – 37wt%Zn substrate during homogenization annealing substantially depends on electroplating parameters. Experiments carried out to determine phase growth solute profile at various current densities reveal that the increase of density tends reduce growth. The coefficient has been determined is found be dependent relativ...

Corrosion of nickel and copper electroplated coatings on SS316H in molten FLiNaK salt was studied. 500- 1000-hour static corrosion tests were performed at 700 degrees Celsius. Characterization the following indicated that they did not degrade during experiment fully protected underlying from chromium dissolution. Interdiffusion between coating extremely limited, interdiffusion SS316H. Diffusion...

We report on magnetic bias in biphase systems arising from by dipolarlike interaction. Composites consist of amorphous ribbons and wires prepared by rapid solidification techniques, surrounded by an electroplated layer. Amorphous metallic core is Co0.94Fe0.06 72.5Si12.5B15 with ultrasoft magnetic behavior coercivity of 10–10−1 A/m , and the electroplated coating is crystalline Co85Ni15 alloy wi...

Effect of the change of crystallinity and micro texture of electroplated copper thin films by annealing on the stressinduced migration was investigated experimentally and theoretically. The micro texture of electroplated copper thin films changed drastically as a function of their electroplating conditions and the annealing temperature after the electroplating. The crystallinity of the electrop...