نتایج جستجو برای: chips of alloy

تعداد نتایج: 21169958  

2006
Fadi Zaraket Adnan Aziz Sarfraz Khurshid

Alloy uses a first-order relational logic for modeling designs. The Alloy Analyzer translates Alloy formulas for a given scope, i.e., a bound on the universe of discourse, to Boolean formulas in conjunctive normal form (CNF), and subsequently checks them using propositional satisfiability solvers. We present SERA, a novel algorithm that compiles a relational logic formula for a given scope to a...

Alikhanzadeh-Arani, S, Almasi-Kashi, M, Mokarian, M H,

In this research, FeNi@PANI nanocomposites as the electromagnetic wave absorbers were prepared through two following steps. At first, FeNi alloy nanoparticles were synthesized by the one-pot polyol process, and then, in-situ polymerization method was used for the preparation of FeNi@PANI nanocomposite. The XRD pattern confirmed the formation of pure FeNi alloy with the FCC crystalline phase. Th...

2007
Tarek Sobh M. Khaled Elleithy Sarosh Patel

The reverse engineering process for VLSI chips is a complex operation that can cost from $10,000 for the simplest chips to hundreds of thousands of dollars for complex chips. In this study, we present an overview of the process of reverse engineering VLSI chips. The study outlines the steps involved in the process of reverse engineering chips as well as the different techniques used to extract ...

1939

The present conditions of classroom instruction to numbers of children still too large to be adequately handled, makes it nearly inevitable that the problem of educafor teachers of backward children should become largely a question of measuring abilities, testing attainments and organising children into more homogeneous grades; and within those grades, diagnosing and treating by individual meth...

2001
Scott F. Popelar

A solder fatigue model for the 63Sn/Pb solder alloy has been previously introduced which characterizes the creep fatigue phenomena of the solder by combining nonlinear finite element modelling with experimental thermal fatigue lives of various flip chip assemblies. The model correlates the amount of creep strain energy dissipated per thermal cycle with the characteristic Weibull life of the cri...

Journal: Journal of Nanoanalysis 2016
Qi Wong Yong Li

The Fe-Ni-Sb-B amorphous alloy has been prepared by a solid-solid chemical reaction of ferric trichloride, nickel chloride, antimony chloride and potassium borohydride powders at room temperature. The inductive couple plasma study indicates that the resultant is composed of Fe 5.38 %, Ni 56.19 %, Sb 29.02 % and B 0.44 %. The XRD and thermal analysis show that the alloy is a non-strict sense amo...

J. Shahbazi Karami M. Jooybari M. Sheikhi,

In the present study, mechanical properties and low cycle fatigue behavior of a solid-solutionized AA6061 aluminum alloy produced by equal channel angular pressing (ECAP) process were investigated. The grain refinement after two passes of ECAP significantly increased the yield stress and ultimate tensile stress and decreased the ductility of the alloy. However, the improvement of low cycle fati...

Journal: :Nature Physics 2019

Journal: :Nano Biomedicine and Engineering 2011

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