Electroless metal plating in combination with nanochannel-containing templates is a versatile method for the fabrication of metal nanotubes [1]. In contrast to the electrodeposition of metals, electroless plating relies on the surface-selective chemical reduction of a metal precursor [2]. The simultaneous coverage of the whole template surface with metal nanoparticles favors the formation of tu...

The electroless coating technique is one of the elegant methods available for the production of protective coatings on surface. Our study has been aimed at the conditions of the electroless deposition of copper coating onto the iron powder particles from sulphate electrolyte. The course of the electroless process depends on the composition and pH of the electrolyte as well as on the size and co...

The information contained in this publication has been compiled from the literature and through communication with recognized experts within the metal finishing industry. It is presented as a guide to the use of electroless nickel for engineers, metallurgists, designers and others involved in materials selection. The important properties of electroless nickel deposits are described and examples...

A low-cost, solution-processed, versatile, microfluidic approach is developed for patterning structures of highly conductive metals (e.g., copper, silver, and nickel) on chemically modified flexible polyethylene terephthalate thin films by in situ polymer-assisted electroless metal deposition. This method has significantly lowered the consumption of catalyst as well as the metal plating solution.

For solder based flip-chip assembly, the deposition of an under bump metallisation (UBM) layer onto the surface of the AI bondpads of the die is the first step in the wafer bumping process. The UBM is necessary, as the fragile AI pad has a tenacious oxide layer that cannot be soldered without the use of strong fluxes and a barrier layer is required to prevent dissolution of the bondpad into the...

In this paper, the authors present an experimental study of roughness characteristics of electroless Ni-B coatings and optimization of the coating process parameters based on L27 Taguchi orthogonal design. Three coating process parameters are considered viz. bath temperature, reducing agent concentration, and nickel source concentration. It is observed that concentration of reducing agent toget...

We present a novel method for producing complex metallic nanostructures of programmable design. DNA origami templates, modified to have DNA binding sites with a uniquely coded sequence, were adsorbed onto silicon dioxide substrates. Gold nanoparticles functionalized with the cDNA sequence were then attached. These seed nanoparticles were later enlarged, and even fused, by electroless deposition...

We propose a novel method to fabricate three-dimensional magnetic microparts, which can be integrated in functional microfluidic networks and lab-on-a-chip devices, by the combination of two-photon microfabrication and selective electroless plating. In our experiments, magnetic microparts could be successfully fabricated by optimizing various experimental conditions of electroless plating. In a...