Metallization of polyethylene (PE) using thermal spray techniques has proved difficult due to its low melting point and softness. In this study, metallic coatings were applied on porous substrates a twin wire-arc process. Commercially available sheets, 3 mm in thickness, used as substrates. Copper (Cu), aluminum (Al), zinc (Zn) successfully deposited the polymer, without prior surface preparati...

We examined the feasibility of alumina substrate metallization by magnetron deposition copper coatings with thickness several tens µm for its prospective applications in production ceramic PCBs and packaging. The films were prepared sputtering systems cooled thermally insulated (hot) targets. Substrates different geometries used, including those through-holes. Thickness, adhesive properties, el...

Vertically aligned carbon nanofibers ~VACNFs! are extremely promising cathode materials for microfabricated field emission devices, due to their low threshold field to initiate electron emission, inherent stability, and ruggedness, and relative ease of fabrication at moderate growth temperatures. We report on a process for fabricating gated cathode structures that uses a single in situ grown ca...

Solid-state thermoelectric generators (TEGs) are promising solution for waste heat recovery. However, they typically suffer from lower conversion efficiency, lack of reliable high temperature device fabrication process and long-term stability. In order to realize electrical efficiency (ECE) in TEGs, it is critical that conjunction with TE materials figure merit, zT, there also a module process....