In the 1980s—the early days of circuit boards—most failures were due to poor solder joints on the boards, imperfections among board connections, or problems with the bonds and bond wires from integrated circuit (IC) pads to pin lead frames. The Joint Test Action Group (JTAG) formed in 1985 to provide a pins-out view from one IC pad to another so these faults could be examined. The eventual resu...

A semiconductor processing method for the formation of self-aligned via and trench structures in III-V semiconductor devices in particular, on InP platform is presented, together with fabrication results. As a template for such self-aligned via and trench formations in a surrounding polymer layer on a semiconductor device, we make use of a sacrificial layer that consists of either a SiO2 dielec...

We demonstrate the design of an integrated conditional quantum teleportation circuit and a readout circuit using a two-dimensional photonic crystal single chip. Fabrication and testing of the proposed quantum circuit can be accomplished with current or near future semiconductor process technology and experimental techniques. The readout part of our device, which has potential for independent us...

The performance of the manufacturing process in each of these areas determines the overall manufacturability of the process. As device geometries are reduced, understanding and minimizing the sources of process-induced defects is critical to achieving and maintaining high device yields. This paper presents comprehensive the investigating a novel metrology on semiconductor process module integra...

A 2+1 dimensional PDE traveling wave model describing spatial-lateral dynamics of edge-emitting broad area semiconductor devices is considered. A numerical scheme based on a split-step Fourier method is presented and implemented on a parallel compute cluster. Simulations of the model equations are used for optimizing of existing devices with respect to the emitted beam quality, as well as for c...

Device testing represents the single largest manufacturing expense in the semiconductor industry, costing over $40 billion a year. The most comprehensive and wide ranging book of its kind, Testing of Digital Systems covers everything you need to know about this vitally important subject. Starting right from the basics, the authors take the reader through automatic test pattern generation, desig...

Semiconductor chips are used today not only to control systems, but also to protect them against security threats. A continuous battle is waged between manufacturers who invent new security solutions, learning their lessons from previous mistakes, and the hacker community, constantly trying to break implemented protections. Some chip manufacturers do not pay enough attention to the proper desig...

Purpose – To determine the status of internet and e-commerce adoption by the Taiwan semiconductor industry, the research is designed to help government and enterprise in formulating strategic plans and making resource allocation decisions. Design/methodology/approach – Using the three-level model of internet commerce adoption (MICA), a survey of 287 companies and web sites was designed. Semicon...