Electrical contacts used in semiconductor device testing are often deposited with a small pip of dark colour contaminants after being subjected to repeating cycles of impact loading. Samples of used electrical contacts are checked under SEM and EDX. It is discovered that the contaminants contain high percentage of tin elements. The reason as to why the contamination formed is investigated and i...

poor adhesion between two successive bituminous layers causes adverse effects on the structural strength of the pavement and develops a numbers of premature failure. to improve the adhesion, it is a general practice to apply a tack coat over an existing or newly constructed bituminous surface before laying another bituminous layer. the main objective of this study is to explore the influence of...

The isolated base, plastic molded, power semiconductor module assembly has been available for various devices for over twenty years. During this time the power bipolar junction transistor, the BJT, has given way to the Insulated Gate Bipolar Junction Transistor, the IGBT, as the self commutatible device of choice especially for voltage source inverter topologies. As part of the power structure ...

In this paper, an analytical model for a vertical double implanted metal-oxide semiconductor (DIMOS) transistor structure in 4H-Silicon Carbide (SiC) is presented. Simulation for transport characteristics of the SiC MOSFET with the exact device geometry is carried out using the commercial device simulator MEDICI. A rigorous experimental testing and characterization is done on a 4H-SiC DIMOS tra...

During the past few years, a lot of work has been done on behavioral models and simulation tools. But a need for modeling strategy still remains. The VHDL-AMS language supports the description of analog electronic circuits using Ordinary Differential Algebraic Equations (ODAEs), in addition to its support for describing discrete-event systems. For VHDL-AMS to be useful to the analog design ...