The influence of the nucleation process of Ag particles on the formation of Si nanowire arrays is investigated by two-stage electroless chemical etching. The dimensions of the Ag particles formed in the first stage of the process play an important role in the formation of the Si nanowires. The nucleation and etch result are analysed using SEM. The electrical properties of the resulting Si NW ar...

The growth kinetics of intermetallic compound layers formed between eutectic Sn–58Bi solder and (Cu, electroless Ni–P/Cu) substrate were investigated at temperature between 70 and 120◦C for 1 to 60 days. The layer growth of intermetallic compound in the couple of the Sn–58Bi/Cu and Sn–58Bi/electroless Ni–P system satisfied the parabolic law at given temperature range. As a whole, because the va...

Two coatings have been developed for petrochemical compressor antifouling and corrosion resistance purposes. One is a multilayer composite coating with a modified polytetrafluoroethylene (PTFE) impregnated organic topcoat, which gives it superior antifouling performance to the similar coating that has been used by the compressor original equipment manufacturers (OEMs). The other is a high-phosp...

As the laminate substrate industry moves from Hot Air Solder Level (HASL) finishes, alternate plating finishes are being proposed such as immersion gold/electroless nickel, electroless palladium and electroless silver. This paper presents results of an evaluation of the thermosonic gold ball wire bondability of electroless palladium. Two palladium thicknesses, with and without a nickel underlay...

Ni-P and Ni layers multilayer coatings were applied to AZ31 magnesium alloy utilizing electroless and electrodeposition procedures. The aim of the project was to decrease cracks and increase corrosion resistance of the coatings. In order to compare the coatings, the effect of single layer electroless Ni-P coatings with different thicknesses was also investigated. The microstructure and phase co...

Sub-100-nm silicon nanohole arrays were fabricated by a combination of the site-selective electroless deposition of noble metals through anodic porous alumina and the subsequent metal-assisted chemical etching. Under optimum conditions, the formation of deep straight holes with an ordered periodicity (e.g., 100 nm interval, 40 nm diameter, and high aspect ratio of 50) was successfully achieved....

The formation of Au microbump arrays for flip-chip bonding was investigated using an electroless Au plating bath. Generally, electroless Au deposition gives a low deposition rate, preventing the fabrication of Au bumps with heights of more than 5 μm. To overcome this problem, we developed a new electroless Au deposition process that employs a non-cyanide bath. This process delivers a high depos...

In this study, interfacial reactions of electrolytic Ni and electroless Ni(P) metallization of the ball-grid-array (BGA) substrate with the molten n–9Zn (wt.%) eutectic solder alloy were investigated, focusing on the shear strengths and the identification of the intermetallic compound IMC) phases at various reflow periods. Zn-containing Pb-free solder alloys were kept in molten condition (240 ◦...

t is well recognized that electroless I.' nickel-phosphorus offers excellent deposition characteristics, such as uniform coverage, freedom from porosity, hardness, corrosion resistance, solderability, braze and weldability, wear resistance and lubricity.' Interest in the properties of electroless nickel has grown in recent years, leading to the development of wide-ranging applications, a compre...