Due to the high hardness and wear resistance, electroless nickel-boron (Ni-B) coatings have found numerous applications. In the present study, the influence of the heating rate on the morphological features of oxidized electroless Ni-B coatings was investigated. The oxidation behavior of electroless coating layers was studied with TGA method under non-isothermal conditions at heating rates 5, 9...

In the previous chapter, the components of electroless nickel plating baths were discussed from the viewpoint of the function each performs in the bath, with little attention paid to their effect on the plating process. The metal and the electron source (the reducing agent) are consumed in the electroless plating reaction and so their concentrations in the bath are continuously decreasing. Ther...

An electroless deposition method comprised of seed formation and subsequent seeded growth is developed for the decoration of surface-grown single-walled carbon nanotubes (SWCNTs) with gold nanoparticles of controlled size and interparticle distance. The density of the gold nanoparticles is determined by the density of seeds. Gold seeds are used for the SWCNT arrays grown on SiO(x)/Si substrates...

A novel technique for obtaining nonanomalous Ni-Zn-P coatings with high Ni content ~74 wt % as compared to 15-20 wt % in the conventional plating method! has been developed. These coatings show promise as a replacement for Cd in sacrificially protecting steel. Ni-Zn-P coatings were deposited using an electroless method from a solution containing NiSO4 , complexing agent and ammonium chloride. V...

Cu-filled TSV (through silicon via) is important technology for 3-D LSIs in order to obtain higher packing density, faster signal transmission, and lower power consumption. Diameter of TSV is expected to be smaller than 2 μm, and its aspect ratio to be larger than 10 in near future [1]. For realizing a high aspect ratio Cu-filled TSV, it is essentially important to form the barrier and seed lay...

ELECTROLESS DEPOSITION OF SUPERCONDUCTING MAGNESIUM DIBORIDETHIN FILMS ON VARIOUS SUBSTRATES

In this project work Si nanowires were fabricated on the Si substrate by aqueous method. In this aquoues method Ag is used for electroless chemical etching. The precursors those were taken are AgNO3, HF and H2O2. Si nanowires are fabricated at 550C. The samples were characterized by X-ray diffraction and scanning electron microscope. Result shows morphology of the Si nanowires by scanning elect...

Carbon nanotubes are coated with a layer of copper by an electroless plating method. To prepare CuOrcarbon nanotubes, Curcarbon nanotubes are oxidized by heating to 1608C in air for 12 h. The lithium insertion properties of carbon and CuOrcarbon nanotubes are tested by an electrochemical method. Carbon nanotubes can reversibly store 700 mA h Li g carbon, while CuO in CuOrcarbon nanotubes can re...