Abstract In this study, we demonstrate how metal-oxide thin-film conformal coatings grown by atomic layer deposition (ALD) can be exploited as an effective approach to mitigate tin whisker growth on printed circuit boards. First, study the effect of different ALD and process parameters Sn–Cu-electroplated test coupons, combining optical imaging scanning electron microscopy evaluating distributi...

Electromigration tests were performed on passivated electroplated Au four terminal Kelvin line structures using the conventional in situ resistance monitoring technique. The stress conditions were a current density of 2.0 MA/cm with ambient temperatures ranging from 325°C to 375°C. The temperature coefficients of resistance (TCR) values were measured prior to current stressing to calculate the ...

Mn–Co alloys were electroplated on AISI 430 stainless steel using an electrodeposition technique with the aim to reduce oxidation and chromium volatilization. The electroplating parameters designed improve coating quality. increased current density decreased MnSO4 content resulted in a denser layer. A sample coated 0.10 M CoSO4 0.50 at 350 mA cm−2 showed best resistance after being oxidized 800...

The movement to eliminate lead (Pb), especially active in Japan and the European Union, has resulted in an increasing use of pure tin (Sn) coatings on leads and other external and internal surfaces of capacitors, resistors, and other passive components. This paper discusses the issues of tin whisker growth with respect to passive components. It also presents both a critical analysis of existing...

This paper presents the process development towards a new generation of nanostructured thermoelectric generators for power harvesting from small temperature gradients by using a combination of traditional silicon microfabrication techniques, electroplating and submicron ion-track nanolithography. Polyimide nanotemplates with pore diameters ranging from 30 nm to 120 nm were fabricated. Prelimina...

This paper presents design, fabrication, and characterization of easy-to-handle electroplated nickel microgrippers with SU-8 adaptors for heterogeneous micro/nano assembly applications. Two distinctive designs of microgrippers as end-effectors of micro/nano assembly applications have been developed in this work. The first design is 200 lm thick electroplated nickel microgripper with a plastic m...

PVD (physical vapor deposition) and CVD (chemical have gained greater significance in the last two decades with mandatory shift from electrodeposition processes to clean deposition due environmental, public safety, health concerns. Due frequent use of coatings several industrial sectors, importance studying chromium coating through PVD–sputtering can be realized, investing a real alternative el...

To understand a void formation mechanism in electroplated Cu interconnects used for Si-ULSI (ultra-large scale integrated) devices, microstructures of Cu films which were prepared by the electroplating technique using plating baths with or without organic additives were investigated by transmission electron microscopy (TEM). In the as-deposited samples, a high density of micro-voids were observ...