In the past 30 years, electroless nickel (EN) plating has grown to such proportions that these coatings and their applications are now found underground, in outer space, and in a myriad of areas in between. Moreover, in order to further improve the mechanical and tribological properties of the nickel-phosphorous (Ni-P) coatings, Ni-P/PTFE composite coatings can be obtained, which provides even ...

in the past 30 years, electroless nickel (en) plating has grown to such proportions that these coatingsand their applications are now found underground, in outer space, and in a myriad of areas inbetween. moreover, in order to further improve the mechanical and tribological properties of thenickel-phosphorous (ni-p) coatings, ni-p/ptfe composite coatings can be obtained, which provideseven grea...

Electrophysiological Sensors In article number 2200342, Ryan Kaveh, Ana C. Arias, and co-workers present a fabrication method for rapidly producing low impedance, anatomically fit dry electrodes that do not require hydrogels. By using electroless copper gold plating with 3D printing, biocompatible can be optimized individuals at fraction of the cost existing vacuum deposition-based techniques.

Lead-free soldering for electronic industry is a segment of global trend toward lead-free environment. Although initiated in U.S. in early 1990’s, it advanced much more rapidly in Japan and Europe. This differentiation in Pb-free progress triggered great concerns of users of Pb-containing solders about maintaining business opportunity, therefore further expedites the advancement of Pb-free sold...

Abstract Low temperature joining is desirable for aluminum-ceramics because aluminum has a large coefficient of thermal expansion. In the present work, Al2O3 to Al was performed at room by two-step deposition method including Ni electroless and Cu electrodeposition. The strength increased, fracture mode changed from Ni/Al2O3 interface that in substrate using porous or etching dense surface. Thu...

Brittle solder joints in Electroless Ni electroless Pd immersion Au (ENEPIG) surface finishes are one of the key re­ liability issues in electronics assembly. Previous characterization of the reflow process has indicated that interfa­ cial voids formed after solder reflow are responsible for the decreases in solder joint strength. However, the mechanisms behind the formation of these voids in t...