Effects of annealing treatment after equal channel angular pressing (ECAP) on the interface properties and shear bond strength of Al/Cu bimetallic rods were investigated. For the as-deformed samples, the one with two passes of ECAP indicated higher shear bond strength. Formation of a layer of intermetallic compounds after annealing treatment is confirmed. In general, by increasing annealing tem...

In this study the intermetallic (IMC) thickness of Sn-Pb, Sn-Zn and Sn-Zn-Bi solders on copper (Cu) substrate were measured at different temperatures using reflow methods. Cu6Sn5 intermetallic phase was detected between Sn-Pb solder and Cu substrate. The -Cu5Zn8 phase was detected between Sn-Zn and Sn-Zn-Bi lead-free solders with Cu substrate. The thickness of the intermetallics increases with ...

intermetallic phase formation and oxidation reaction during combustion synthesis (cs) of ni-ti equiatomic mixture are affected by mechanical activation (ma) and pre-heating conditions. important parameters are ignition time, reaction duration, temperature rise, microstructural change, titanium oxidation and intermetallic phase formation. superelasticity and shape memory effects are influenced b...

The sugar recognition by binuclear copper(II) complexes in solution is strongly dependent on secondary interactions and cannot be predicted from the intermetallic Cu...Cu distance.

In this study, microstructure evolution at intermetallic interfaces in SnAgCu solder joints of an area array component was investigated at various stages of a thermal cycling test. Failure modes of solder joints were analyzed to determine the effects of process conditions on crack propagation. Lead-free printed-circuit-board (PCB) assemblies were carried out using different foot print designs o...

The reliability of portable electronic devices was studied by applying standardized test procedures for test vehicles that represent the technologies and lead-free materials typically used in novel portable products. Thermal cycling and drop testing are commonly used because they reveal the failure modes and mechanisms that portable devices experience in operational environments. A large number...

In situ X-ray photoelectron spectroscopy (in situ XPS) was used to study the structural and catalytic properties of Pd-In near-surface intermetallic phases in correlation with previously studied PdZn and PdGa.Room temperature deposition of ∼4 monolayer equivalents (MLEs) of In metal on Pd foil and subsequent annealing to 453 K in vacuum yields a ∼1:1 Pd/In near-surface multilayer intermetallic ...

Metallic-intermetallic laminate (MIL) composites are promising materials for structural applications especially in the aerospace industry. One of the interesting laminate composites is the Ti-TiAl 3 multilayer. In this work, commercially pure sheets of aluminum and titanium with almost equal thickness of around 0.5 mm were explosively joined. The achieved multilayers were annealed at 630 ℃in di...