in this paper, we have studied the electrical properties of the randomly distributed metallic (co and fe) nano/ micro wires on silicon substrate. deposition was carried out potentiostatically into the pores of the track-etch polycarbonate membrane spin coated onto the si substrate. spin coated films were irradiated with 150mev ni (+11) ions at a fluence of 8e7 ions/cm2, followed by uv irradiati...

OF DOCTORAL DISSERTATION HELSINKI UNIVERSITY OF TECHNOLOGY P.O. BOX 1000, FI-02015 TKK

The current paper constructs a progress measurement appropriate for measuring multiple and different dimensions of progress. The paper is not meant to be a detailed discussion of the framework but rather a demonstrated application of the measure. The constructed resource-infrastructure-environment (RIE) progress measure employs a nonmonetary evaluation adopting a weighting technique based on pu...

Deep-etch-defined GaAs/Al0.3Ga0.7As square features of multiquantum well material, with dimensions as small as 160 nm, have been fabricated using magnetron reactive ion etching ~MIE!. Luminescence spectroscopy shows confinement of charge carriers to the features’ center. The effects of rf power and etching time on the luminescence efficiency of these features and its concomitant etch-induced da...

Microstructured carbon materials are interesting for electrochemical systems such as micro fuel cell electrodes and flow fields. Glassy carbon (Sigradur G) can be microstructured by various methods such as sawing, laser machining, and reactive ion etching (RIE). An alternative for fuel cell applications is Sigracet, a graphite in a polymer matrix. Various laser wavelengths ranging from 308 to 1...

Recently developed Critical-Angle Transmission (CAT) grating technology in combination with x-ray CCD cameras and large collecting-area focusing optics will enable a new generation of soft x-ray spectrometers with unprecedented resolving power and effective area and with at least an order of magnitude improvement in figures-of-merit for emission and absorption line detection. This technology wi...

As feature sizes shrink to sub-50 nm for spin transfer torque (STT) devices and to sub-10nm for ultra-high density bit patterned media (BPM), anisotropic, defect free etching becomes difficult with conventional techniques, such as ion milling. Instead, reactive ion etching (RIE) must be used to meet the challenge. In this work, we present research on the development of a methanol based RIE tech...

A HSQ/PMMA bilayer resist system, in which HSQ as negative tone electron beam resist top layer and PMMA as bottom layer, has been investigated for negative tone lift-off process. Patterns are first defined on the HSQ resist using electron beam lithography, and then transferred into the bottom PMMA layer using oxygen reactive ion etching. Electron beam exposure of HSQ on top of PMMA layer has be...

This paper describes a new fabrication method for the simultaneous creation of multi-level single-crystalline silicon structures, each with a different thickness. The method combines deep dry etching and wet anisotropic etching of silicon in order to avoid multiple back-side alignment steps and timed etches. The levels are defined in a single lithographic step from the front side. The fabricati...

The main objective of this research is to develop a micro and nanogap structure using dry anisotropic etching –Reactive Ion EtchingRIE. Amorphous silicon material is used in the micro and nanogap structure and gold as electrode. The fabrication processes of the micro and nanostructure are based on conventional photolithography, wet etching for the Al pattern and wet etching for a-Si pattern usi...