The reactive ion etching ofInP, InGaAs, and InAIAs in CClzF2/02 or C2R(/H2 discharges was investigated as a function of the plasma parameters pressure, power density, flow rate, and relative composition. The etch rates of these materials are a factor of 3-5 X faster in CC12F 2/0 2 (-600--1000 AminJ ) compared to CzHJH2 (160-320 AminI ). Significantly smoother morphologies are obtained with C2H6...

This paper presents the fabrication and characterisation of wet and reactive ion etched ridge waveguide InGaAs/InGaAsP/InP lasers with an operating wavelength of 1.5μm. Characterisation results of InGaAs/InGaAsP/InP lasers are given of two etching methods, namely wet chemical etching and reactive ion etching. Relative advantages and disadvantages of these two methods are also discussed comparat...

Materials and Methods Nanofluidic chips Nanofluidic chips were fabricated from a silicon wafer with 2 μm thermal oxide in cleanroom facilities at Chalmers University of Technology. Nanochannels were created by electron-beam lithography (JBX-9300FS/JEOL Ltd) and reactive ion etching (Plasmalab 100 ICP180/Oxford Plasma Technology). Microchannels were made by optical lithography (MA 6/Suss MicroTe...

Advances in material processing such as silicon micromachining are opening the way to vacuum microelectronics. Two-dimensional vacuum components can be fabricated using the microsystems processes. We developed such devices using a single metal layer and silicon micromachining by DRIE. The latter technological step has significant impact on the characteristics of the vacuum components. This pape...

Micromachined vacuum pumps are one of the key components in miniature systems for chemical and biological analysis. Miniature sensors and analyzers are normally operated at the pressure range lower than a few millitorr. We are developing a micromachined vacuum pump that is comprised of a mechanical rough pump integrated with micromachined ion-pumps. The rough pump generates a low vacuum of tens...

 High-aspect-ratio mechanical structures fabricated using deep reactive ion etching generally have a non-rectangular profile. The profile can severely influence the mechanical performance of the device. We have quantified the profile shape for through-wafer etched beams and presented an analytical model to evaluate the effect of profile shape on silicon lateral suspensions. A design methodolog...

Reactive Ion Etching of Dielectrics and Silicon for Photovoltaic Applications Prakash N. K. Deenapanray1*,y, C. S. Athukorala, Daniel Macdonald, W. E. Jellett, E. Franklin, V. E. Everett, K. J. Weber and A. W. Blakers Centre for Sustainable Energy Systems, FEIT, The Australian National University, Canberra ACT 0200, Australia Department of Engineering, FEIT, The Australian National University, ...

Parylene C, an emerging material in microelectromechanical systems, is of particular interest in biomedical and lab-on-a-chip applications where stable, chemically inert surfaces are desired. Practical implementation of Parylene C as a structural material requires the development of micropatterning techniques for its selective removal. Dry etching methods are currently the most suitable for bat...