Thick bonding wires are used in modern power modules as connectors between integrated circuits, carrying current from one circuit to another. They experience high values of current, which generates heat through Joule heating and can lead to various failure mechanisms. Typically used wire materials in industry are aluminum (Al), copper (Cu), and intermetallic compounds of Cu-Al. They are broadly...

The thermal conductivity of superconducting MgB 2 was studied in both the superconducting and normal state region. The latter is almost equally determined by the electronic-and the lattice thermal conductivity. In the superconducting state, however, the lattice thermal conductivity is larger. The electronic thermal conductivity below T c was derived from the experimental data considering the Ba...

Simultaneous thermal analysis (STA) method has been applied to study decomposition reactions of AP under a flowing nitrogen atmosphere and static air. Results obtained indicate that a phase transformation occurs prior to the decomposition reaction. Decomposition takes place exothermally in two stages, first stage of decomposition could be suppressed by the controlled heating programme. Addi...

With the increasing clock rate and transistor count of today’s microprocessors, power dissipation is becoming a critical component of system design complexity. Thermal and power-delivery issues are becoming especially critical for high-performance computing systems. In this work, we investigate dynamic thermal management as a technique to control CPU power dissipation. With the increasing usage...

The increased integrations of intermittent renewable energy sources into power systems cause more grid congestions and therefore system operators need advanced control to relieve this pressure. dynamic thermal rating (DTR) is able increase the constraint subsequently maximum loading existing lines. This achieved through real-time considerations weather data it usually much higher than tradition...