This study investigated the interfacial microstructure between gold-coated titanium and low-fusing porcelain. The square surfaces of cast titanium split rods were sputter-coated with gold using a sputter coater at 40 mA for 1,000 seconds. Specimens were prepared for transmission electron microscopy (TEM) by cutting and polishing two pieces of the gold-coated split-rod specimens, which were glue...

Article history: Received: 28.11.2012. Received in revised form: 04.01.2013. Accepted: 15.01.2013. The microstructural evolution of the coexistence of spinodal decomposition and ordering is characterized by metallographic microscopy and transmission electron microscopy in aged Fe-23Al (i.e. Fe-23at%Al) alloy. This paper discusses a phase transition mechanism of the microstructure evolution. The...

Intermetallic compounds have been studied for their potential application as structural wear materials or coatings on engineering steels. In the present work, a newly designed intermetallic composite in a Ni-Mo-Si system was fabricated by arc-melting process with commercially pure metal powders as starting materials. The chemical composition of this intermetallic composite is 45Ni-40Mo-15Si (at...

When the complexity of a metallic compound reaches a certain level, a specific location in the structure may be critically responsible for a given fundamental property of a material while other locations may not play as much of a role in determining such a property. The first-principles theory has pinpointed a critical location in the framework of a complex intermetallic compound--Gd(5)Ge(4)--t...

Increasing environmental concerns and pending government regulations have pressured microelectronic manufacturers to find suitable alternatives to Pb-bearing solders traditionally used in electronics packaging. Over recent years, Sn-rich solders have received significant attention as suitable replacements for Pbbearing solders. Understanding the behavior of intermetallics in Sn-rich solders is ...