Three-dimensional electrodes that are controllable over multiple lengthscales are very important for use in bioanalytical systems that integrate solid-phase devices with solution-phase samples. Here we present a fabrication method based on all-solution-processing and thin film wrinkling using smart polymers that is ideal for rapid prototyping of tunable three-dimensional electrodes and is exten...

The new revolution in materials science is being driven by our ability to manipulate matter at the molecular level to create structures with novel functions and properties. The aim of this paper is to explore new strategies to obtain plasmonic metal nanostructures through the combination of a top down method, that is electron beam lithography, and a bottom up technique, that is the chemical ele...

This paper deals with the preparation and characterization of Nickel-coated Alumina ceramic particles by Electroless Plating Technique. Nanosized α-Al2O3 powders of about 50nm in diameter are used for plating. The bath for Electroless Nickel Plating is prepared with NiCl2.6H2O, C6H5NaO7.H2O, NH4Cl and NaH2PO2.H2O. A bath temperature of 85°C, pH value of 8 and stirring time of 20 min is consider...

Nanoporous carbon is coated by pure nickel via an electroless plating method. The nanoporous carbon provides a high-surface-area substrate, leading to a large capacitance; the nickel surface layer is of a high work function, resulting in a thermally sensitive electrode potential. Such a system is ideal for thermally chargeable supercapacitor (TCS) system, which converts low-grade heat (LGH) to ...

Glassy carbon electrodes were coated with the film poly-(p-allyl ether benzenesulfonic acid) by an anodic procedure. Nickel, platinum, and palladium ions were introduced into the film by ion exchange of H(+) with the corresponding salts. These ions were catalytically reduced to their corresponding metals using the known electroless reducing agent sodium hypophosphite. Scanning electron microcop...

Electroless deposition for fabricating copper Cu interconnects of integrated circuits has drawn attention due to its low processing temperature, high deposition selectivity, and high coverage. In this paper, three-dimensional computer simulations of the qualitative growth properties of Cu particles and two-dimensional simulations of the trench-filling properties are conducted. The mathematical ...

This paper reports the -SiC particles surface modification by copper Electroless Plating (EP), as well as a morphological characterization of Al-Si reinforced composite obtained with such modified particles and consolidated by compoforging. The -SiC particles were obtained by thermal degradation of organic waste. The compoforging technique is a hybrid between the compocasting process and semi-s...

in this research a layer of ni-cu-p was deposited on 304 stainless steels by using gelatin and thiourea asadditives in a sulfate solution. in order to determine the properties of deposited layers, a microhardness testerwas used for microhardness measurement, x.r.d. for microstructural analysis, and a scanning electronmicroscope equipped with e.d.x. for determining morphology and analyzing the d...

In the present work copper/diamond composites, such as (Cu-10 Vf % diamond uncoated, Cu-30 Vf % diamond uncoated, Cu-10 Vf % diamond coated NiCrB and Cu-30 Vf % coated NiCrB) as heat sink materials have been fabricated using powder metallurgy and electroless techniques. The copper powder used in this study has been fabricated using electroless technique and the diamond powder was electroless co...

In this study, UBM material systems for flip chip solder bumps on Cu pads were investigated using the electroless copper (E-Cu) and electroless nickel (E-Ni) plating methods; and the effects of the interfacial reaction between UBMs and Sn–36Pb–2Ag solders on the solder bump joint reliability were also investigated to optimize UBM materials for flip chip on Cu pads. For the E-Cu UBM, scallop-lik...