INTRODUCTION Wafer Level Packages have emerged as the fastest growing semiconductor packaging technology. Rather than a single solution, wafer level packaging technologies are a set of different solutions including flip-chip wafer bumping, electroplated gold, solder bumps and recent copper pillar technologies. These chips can be

Anthropogenic sources account for much of the zinc (Zn) in the environment. Constraining the isotopic composition of anthropogenic Zn is therefore essential to understanding the environmental biogeochemical cycling of Zn isotopes. This study examines the isotopic variability in several different categories of anthropogenic Zn. Pure Znmetal and Zn dust are the rawmaterials used in many Zn-contai...

Abstract Recently, the integration of a maraging steel heat treatment into vacuum brazing has been conducted successfully to manufacture high-strength and sound cemented carbide-steel joints with elevated mechanical properties component. Besides use low-melting silver-based active filler alloys cost-intensive palladium-containing alloys, application nickel layer on surface by an arc-PVD process...