Bulk metallic glasses (BMGs) and nanocrystalline metals (NMs) have been extensively investigated due to their superior strengths and elastic limits. Despite these excellent mechanical properties, low ductility at room temperature and poor microstructural stability at elevated temperatures often limit their practical applications. Thus, there is a need for a metallic material system that can ove...

An experiment on the early stages of intermetallic compound layer growth during soldering and its theoretical analysis were conducted with the intent to study the controlling factors of the process. An experimental technique based on fast dipping and pulling of a copper coupon in liquid solder followed by optical microscopy allowed the authors to study the temporal behavior of the sample on a s...

A carbon tool steel plate was coated with an aluminum foil a thickness of 100 μm by explosive welding. This aluminum-coated heat-treated in the temperature range 973−1273 K for up to 3.6 ks atmosphere form Fe-Al alloy layer on surface. The basically composed Fe2Al5, two kinds FeAl (Al-rich and Fe-rich FeAl), Fe3Al containing (Fe3Al(C)) ferrite stabilized diffusion (α-Fe(Al)). FeAl2 also detecte...

The precipitation strengthening of Cu alloys inevitably accompanies lowering of their electric conductivity and ductility. We produced bulk Cu alloys arrayed with nanofibers of stiff intermetallic compound through a precipitation mechanism using conventional casting and heat treatment processes. We then successfully elongated these arrays of nanofibers in the bulk Cu alloys to 400% of original ...

The effects of a third element, namely silver, copper, zinc, or antimony, on the microstructure and mechanical properties of eutectic tin-bismuth (Sn–Bi) solder were investigated. The investigation showed that, except for zinc, the addition of a trace amount of the third element improves the ductility of the Sn–Bi solder owing to the formation of a fine, homogeneous ternary eutectic microstruct...