نتایج جستجو برای: semiconductor device testing

تعداد نتایج: 1029873  

2001
A. Kleinsasser

We report electrical measurements of ' a sandwich structure consisting of a niobium electrode in contact with a thin lightly doped n type InGaAs layer. The bottom of the sandwich is a degenerate layer of n-type InGaAs used to collect the current. The semiconductor layers are grown by molecular beam epitaxy (MBB). These three layers are the essence of the proposed superconducting-base, semicondu...

Journal: :The Review of Laser Engineering 1984

Journal: :Journal of the Japan Society for Precision Engineering 2007

Journal: :TEION KOGAKU (Journal of Cryogenics and Superconductivity Society of Japan) 1996

1994
Balaji Srinivasan

IMPORTANT NOTICE Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current. TI warrants performance of its semiconductor products and related softwar...

2013
Yoshihito Honsho Tomoyo Miyakai Tsuneaki Sakurai Akinori Saeki Shu Seki

We have successfully designed the geometry of the microwave cavity and the thin metal electrode, achieving resonance of the microwave cavity with the metal-insulator-semiconductor (MIS) device structure. This very simple MIS device operates in the cavity, where charge carriers are injected quantitatively by an applied bias at the insulator-semiconductor interface. The local motion of the charge...

2015
Minakshi Devi Ameen Uddin Ahmad

Multilevel inverters are a source of high power, often used in medium-voltage application. Multilevel converters have received increased interest recently due to high quality output waveform and decrease the harmonic distortion in the output waveform without decreasing the inverter power output. A multilevel inverter uses a series of semiconductor power converters, thus generating higher voltag...

Journal: :IOP Conference Series: Materials Science and Engineering 2019

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