نتایج جستجو برای: variable thickness circular plates

تعداد نتایج: 461611  

N Ahlawat, R Lal

An analysis has been presented of the effect of elastic foundation and uniform in-plane peripheral loading on the natural frequencies and mode shapes of circular plates of varying thickness exhibiting bi-directional functionally graded characteristics, on the basis of first order shear deformation theory. The material properties of the plate are varying following a power-law in both the radial ...

A. Ghasemi, A.R. Yadegari Naeini Yadegari Naeini

Porous materials are lightweight, flexible and resistant to hairline cracks, so today with the development of technology porous structure produced for use in various industries. This structure widely use in beams, plates and shells. The purpose of this paper is to investigate the effect of porosity in axial symmetry in bending and buckling load sheet for analysis. For this purpose, a circular p...

2016
EDWARD L. REISS

The branching of un,symmetric equilibrium states from axisymmetric equilibrium states for clamped circular plates subjected to a uniform edge thrust and a uniform lateral pressure is analyzed in this paper. The branching process is called wrinkling and the loads at which branching occurs are called wrinkling loads. The nonlinear von Karman plate theory is employed. The wrinkling loads are deter...

Journal: :Proceedings of The Royal Society A: Mathematical, Physical and Engineering Sciences 2021

In this work, we propose a general perturbative approach for modal analysis of irregular-shaped plates uniform thickness with boundary conditions. Given plate irregular boundary, first, circular identical and area, centred at the centroid, is determined. The then treated as perturbation suitable smallness parameter, expressed generalized Fourier series. frequency shape function conditions are p...

2013
Romesh C. Batra

1. Tummala RR (2001) Fundamentals of microsystems packaging. McGraw-Hill International Edition, New York 2. JEDEC (2002) Design standard: design requirements for outlines of solid state and related products; JEDEC Publication 95, Design Guide 4.14-1/D, Ball Grid Array Package, JEDEC Solid State Technology Association 3. Vujosevic M (2006) Warpage of flip chip packages. In: Proceedings of IMECE2...

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